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Summary of Electronics Mfg Process
The electronics manufacturing process consists of six operations:
- Op 10 is a Clean and Prep activity where a purchased
assembly is cleaned and placed into a special fixture by Line Op 1.
- Op 20 is a 3-hour baking operation. Parts are carried
to the oven by Line Op 1 and loaded into the oven. The bake cycle will
not begin until a batch of five parts has accumulated. The loading process
takes 10 minutes and requires Line Op 1.
- Op 30 is an assembly operation, where a printed circuit
board is installed. Each batch of 5 assemblies arriving from the oven
is unbatched by Line Op 2 and then processed individually. The operation
takes 40 minutes.
- Op 40 is an Inspect and Test station. Parts are taken
to the inspect/test area by Line Op 2 and placed in an input buffer (a
special cooling apparatus) that can hold only 8 parts at a time. The Inspector
visually inspects each unit and runs a series of tests using a multi-function
Test Unit. The inspection and test operation takes 25 minutes. 70% of
the units pass the test on the first pass, while 30% of them fail and
are sent to Rework.
- Op 45 is the Rework operation. All units can be reworked
manually, which takes 90 minutes on average. A Rework Op completes the
task and takes the units back to the Inspect/Test Queue.
- Op 50 is the final operation, where the Inspector
records the results of the test.